摘要
固结磨料金刚石线锯切割技术有望在将来广泛地应用于硅晶体等硬脆材料的切割,而高性能的固结磨料金刚石锯丝的研制是此技术发展应用的关键。本文选用以瓦特液为基础的光亮镍镀液,采用复合电镀法试制了电镀金刚石锯丝,制定了锯丝的电镀工艺,分析了上砂电流密度和上砂时间对锯丝表面金刚石磨粒密度和镀层与基体间结合力的影响。结果表明,获得表面磨粒分布均匀、结合力良好的电镀金刚石锯丝的最佳电流密度范围为1.5 A/dm2~2.0 A/dm2,其预镀、上砂与加厚镀时间依次为6 min、8 min^10 min和18 min。
The fixed-abrasive wire sawing technology is supposed to be used for slicing hard-brittle materials such as silicon crystal widely in the future, and the development of high performance fixed-abrasive diamond wire saw is the key of application for this technology, So the bright nickel bath was employed to manufacture the electroplated diamond wire saw using composite electroplating method in this paper. The electroplatlng technques of the wire saw was developed, the influences of cathode current density and time at tack-on stage on diamond grits density and adhesion of the substrate and plating coating were analyzed. The results show the optimum tack-on current density to obtain the uniform abrasive-distribution and good adhesion wire saw is 1.5 A/ dm^2 -2.0 A/dm^2, and the time of pre-plating, tack-on and buildup is 6 rain, 8 rain - 10 min and 18 min.
出处
《金刚石与磨料磨具工程》
CAS
北大核心
2007年第6期34-37,共4页
Diamond & Abrasives Engineering
基金
国家自然科学基金资助项目(No.60475132)
山东省自然科学基金资助项目(No.Y2006F16)
关键词
金刚石锯丝
复合电镀
切割
硅晶体
diamond wire saw
composite electroplating
slicing
silicon crystal