摘要
命中精度测量是检验射击类武器弹药性能的重要手段。为了满足轻武器研制中距射击点1000m处测量命中精度的要求,在总结现有命中精度测试方法的基础上,探索了3种非接触命中精度测量方案(半导体光电器件阵列、PSD交汇和CMOS交汇),并着重分析了线阵CMOS相机交汇方案。实验结果表明:两台线阵相机形成的光幕相互交叠,构成垂直于水平面的交汇测量靶面,外触发同步采集图像,可实现对弹丸过靶坐标的分析。该方案可以取代纸靶、网靶、板靶和声靶等命中精度测量方法,有广泛的应用前景。
Hitting accuracy evaluation is an important means of ammunition performance test for firing weapons. In order to meet the requirements of hitting accuracy measurement within the effective range of 1 000 meters in the course of small arms development, based on hitting accuracy measuring sysytem at present, 3 kinds of non-contact hitting accuracy measuring system (semiconductor optoelectric devices array, PSD intersection and CMOS intersection schemes ) were studied, and the CMOS image intersection measuring system was emphasized and analyzed. The experimental results indicated that 2 sets of CMOS device formed intersecting planes, they formed the overlapping upright sky screen that were perpendicular to the horizontal plane, simultaneous grabbing image was carried out by external trigger, and analysis of hit point coordinates was realized. This hitting accuracy measuring system can be used to replace the screens such as "paper target", "wire net", "board target" and "acoustic screen" etc. and the system has wide application prospect in many fields in the future.
出处
《火炮发射与控制学报》
北大核心
2007年第4期62-66,共5页
Journal of Gun Launch & Control
关键词
信息处理技术
命中精度
CMOS图像传感器
交汇测量
跟踪测量
information processing technology
hitting accuracy
CMOS image sensor
intersection measurement
trail measurement