CMP专用硅溶胶研磨料粒径可控增长技术的研究

Study of Particle-size-controllable Growth of Silica Sol Abrasive for CMP

以LaMer模型为理论依据，对恒液面聚合生长法制备硅溶胶的母液制备和粒径增长阶段进行了工艺研究。通过适当加料速率下的母液制备可产生适当数量的晶核，并制得一系列小粒径规格的低分散度硅溶胶。在粒径增长阶段，通过选择与底料中粒径状况相匹配的加料速率，使胶粒均匀长大而制得一系列中等粒径和大粒径规格的硅溶胶。该技术实现了硅溶胶粒径的可控增长。

LaMer model provided theoretical guide to preparation of silica sol through polymerization growth technique with control of constant liquid level. About the preparation of heel with an optimized feed rate, the appropriate nuclei quantity can be got, and these nuclei can be used for preparation of a series of small particle size and lower polydispersition silica sol. In particle growth stage, the optimized feed rate matches on particle status of bed charge, so the particles can grow up in a uniform rate, and the got silica sols have a series of medium and large particle size with lower polydispersition. The technology realizes particle-size-controllable growth of silica sol.