微电子塑封器件界面层裂失效及其数值预测方法研究

界面层裂失效已成为微电子封装和微系统的一个最主要的失效形式之一。本文分析了产生界面层裂失效的原因：一方面，塑封器件在制造和使用过程中受热应力的影响；另一方面，吸湿后产生湿应力与应变，在高温下承受蒸汽压力，若超过极限，就会发生爆米花现象，导致开裂失效。然后介绍了几种界面层裂失效的数值预测方法：J积分法修正的J积分法、虚拟裂纹闭合法及面积能量释放率法等。

Interface delamination has now become the main form of failure in microelectronic packaging and Microsystems. The reasons that induce interface delamination are discussed in this paper： on one hand, plastic package is subjected thermal stress during the manufacturing and its application; on the other hand, after absorbing moisture, humid stress and strain are produced. If plastic package is undertaken vapor pressure during the reflow and the pressure exceeds the limitation, popcorn phenomenon will happen. Then a few methods to predict interface delamination are introduced, such as J-integral Method, modified J-integral Method, Virtual Crack Closure Method and Area Release Method and so on.