摘要
主要研究如何在不损伤聚合物的前提下,实现聚合物波导的端面处理,即对端面的研磨和抛光。由于硅材料和聚合物材料的物理特性差别,除了要选择好特定的抛光材料以外,在抛光时还要特别控制抛光速度和抛光时间:速度过快会造成硅片"塌边"和损坏聚合物膜。试验结果表明:抛光速度在50 r/min以上很容易造成损伤;速度在20 r/min左右的抛光效果较理想。抛光时间不够则不能达到抛光要求。
This paper presents a method to machine waveguide based on silicon wafer. For the different physical character between silicon and polymer, choosing right speed and duration is as crucial as used material used. Experimental results show that the speed of 20 r/min for whetting and polishing is appropriately, while over 50 r/min is improper. Another factor is the duration, which would also determine the result.
出处
《光电子技术》
CAS
2007年第4期228-230,234,共4页
Optoelectronic Technology
基金
教育部科学技术研究重点项目资助(104196)
关键词
光集成器件
聚合物光波导
封装
抛光
optical integrate component
polymer waveguide
packaging, polishing.
