铜试剂分光光度法测定铜在电镀中的应用(Ⅰ)--电镀废水中铜的测定

Application of Cupron Spectrophotometry Determining Copper in Electroplating(Ⅰ)(to be continued)——Determination of Copper in Electroplating Waste Water

介绍了铜试剂分光光度法测定铜时,运用EDTA-Cit-NH4OH混合溶液掩蔽干扰离子,在水相中直接进行测定。应用在电镀分析方面的有:电镀废水中的铜、各种电镀液中的铜杂质、合金镀层中的铜及镀液中的铜盐组分等的测定,并对原理、分析操作和计算等都作了详尽的介绍。

Cupron spectrophotometry determining copper with EDTA-Cit-NH40H mixed solution to screen interference ions and directly determining copper in aqueous solution was introduced. This method can be used in electroplating analysis in following aspects ： analysis of copper in electroplating waste water, analysis of copper impurity in various electroplating bath, analysis of copper in alloy coatings and alloy plating baths etc. Principle, analytical operation and calculation of this method were also introduced in detail.