摘要
概述了耐热性、尺寸稳定性、高频特性,一次多层性和异种材料粘结性优良的热可塑性树脂膜"IBUKI"的开发。它适用于无芯全层IVH一次多层板,嵌入LSI一次多层板、空腔基板、复合基板和弯曲基板之类的高性能PCB用绝缘基材。
This paper describes the development of heat plastic resin film ＂IBUKI＂ having excellent heat resistauce, size stability, high frequency characteristic, Single multilayer and heterogeneoous material bonding. It is suitable to isolation laminate for high performance PCB such as coreless all layer IVH Single multilayer board, LSI buried single multilayer board, cavity board, complex board and deflection board.
出处
《印制电路信息》
2008年第1期24-28,共5页
Printed Circuit Information
关键词
热可塑性树脂膜
高性能PCB
一次多层
复合
空腔
heat plastic resin film
high performance PCB
single multilayer
complex
cavity
