摘要
当前电子产品日新月异,要求电路板高密度组装,安装方式由表面安装(SMT)取代通孔插装(THT)已是历史的必然,因此,印制板技术正向高密度、多层化方向飞速发展。而印制板的合理设计是SMT技术中的关键,也是SMT工艺质量的保证,并有助于提高生产效率。本文就表面安装PCB设计时需考虑的一些制造工艺性问题进行了阐述,给PCB设计人员提供一个参考。
Nowadays, high-density and multi-layer PCB Technology are developing faster and faster in order to meet the need of rapid progress of electronic products. So it has become a must to substitute SMT for THT. PCB design is the key of Surface Mount Technology and guarantee of SMT quality, and it can increase efficiency of production. This paper illustrates some of the concerns in SMT processing technology on PCB designs, offers a reference for PCB designer.
出处
《电子测试》
2008年第1期61-66,共6页
Electronic Test
