摘要
多IP核复用技术在SoC芯片设计中得到广泛应用,一方面带来设计效率的提高,另一方面由于各类IP核质量参差不齐也造成SoC芯片可靠性的降低,本文着重从微处理器可靠性、IP核通信可靠性、IP核状态检测等方面对多IP复用SoC的可靠性进行了研究。
The characteristics and design flow of multi - IP duplicated SoC are introduced in this paper. We have a deep research in reliability of multi - IP duplicated SoC from the flowing four aspects: on - chip MCU, communication between IP cores, on -chip Memory, BIST.
出处
《信息技术与信息化》
2007年第6期52-54,共3页
Information Technology and Informatization
关键词
IP
SoC可靠性
三模冗余
内置自检测
Intellectual - Property System - On - Chip Reliability TMR BIST