期刊文献+

基于多IP核复用SoC芯片的可靠性研究

Reliability Research of Multi-IP-Reused SoC
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摘要 多IP核复用技术在SoC芯片设计中得到广泛应用,一方面带来设计效率的提高,另一方面由于各类IP核质量参差不齐也造成SoC芯片可靠性的降低,本文着重从微处理器可靠性、IP核通信可靠性、IP核状态检测等方面对多IP复用SoC的可靠性进行了研究。 The characteristics and design flow of multi - IP duplicated SoC are introduced in this paper. We have a deep research in reliability of multi - IP duplicated SoC from the flowing four aspects: on - chip MCU, communication between IP cores, on -chip Memory, BIST.
出处 《信息技术与信息化》 2007年第6期52-54,共3页 Information Technology and Informatization
关键词 IP SoC可靠性 三模冗余 内置自检测 Intellectual - Property System - On - Chip Reliability TMR BIST
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参考文献8

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