摘要
介绍了无铅钎料开发和应用上存在的一些问题和基本要求,通过分析国内外Sn-Ag、Sn-Bi、Sn-Zn、Sn-In几大合金系无铅钎料的合金元素、微观组织、润湿性、熔点、腐蚀行为等方面,逐一阐述了近几年来无铅钎料的研究动态和发展趋势,以期为今后无铅钎料开发和应用提供一些有益指导。
Problems and basic demands on Lead-free solder research and application were pointed out in this paper.The main leadfree solder series of Sn-Ag, Sn-Bi, Sn-Zn and Sn-In were introduced in detail in domestic and aboard,including alloy elements, microstructure. wettability, melting point, corrosion behaviour etc.Expected to give some guidance for development and application of lead-free solder in future.
出处
《电焊机》
2008年第1期77-80,共4页
Electric Welding Machine
关键词
无铅钎料
焊接
发展
lead-free solder
weld
development
