BGA/MCM进入现代组装技术的主流

BGA/MCM Enters Mainstream of the Contemporary Assembly Technology

文中分别介绍了ＢＧＡ与ＭＣＭ的概念、分类、发展现状、应用情况及发展趋势等。ＢＧＡ与ＭＣＭ是现代组装技术的两个新概念，是ＳＭＴ（表面贴装技术）与ＳＭＤ（表面贴装元器件）的发展和革新，从其产生到现在，发展不过几年的时间。电子界的权威人士对ＢＧＡ的发展很乐观，他们认为ＢＧＡ将成为高密度、高性能、多功能及高Ｉ／Ｏ引线数封装的最佳选择。而ＭＣＭ将更多地应用ＢＧＡ，逐渐降低成本、减小尺寸和重量，进一步提高性能，成为一种具有竞争力的封装技术。

The things of the BGA/MCM's concept,division,development and applicati on are introduced.BGA and MCM are new concepts of the contemporary assembly technology.It is said that BGA/MCM has developed and innovated the SMT/SMD since they were appeared.It is believed that BGA will be the best choice of the IC with high density,high performance,multiple function and high I/Os.BGA will more be adopted in MCM,and MCM will also be a competitive packaging technology.