印制线路板内层黑氧化前处理微蚀液的研制

Research on microetchant for black oxide pretreatment of PCB lining

研制出一种新型印制线路板内层黑氧化前处理微蚀液,其配方为:100g/LH2SO4,25g/LH2O2,0.4g/L稳定剂A(含羟基的有机酸),0.4g/L促进剂A(同稳定剂A),0.5g/L脂肪胺EO-PO嵌段聚合物。讨论了温度及铜离子浓度对微蚀速率的影响。测试表明,在高浓度铜离子(Cu2+质量浓度25g/L)存在的情况下,微蚀速率较稳定,可达到1.4μm/min以上,且微蚀后铜表面较平整均匀,可完全满足内层黑氧化前处理的生产要求。

A new microetchants of black oxide pretreatment for PCB lining was developed, its formula being as follows： 100 g/L H2SO4, 25 g/L H2O2, 0.4 g/L stable agent A （hydroxyl containing organic acid）, 0.4 g/L accelerant A （the same as stabilization agent A）, 0.5 g/L aliphatic amine EO-PO block polymer. The effects of temperature and copper ion content on etching rate were discussed. The test results showed that, as high copper ion content 25 g/L is used, the etching rate of the microetchant becomes stable, reaching 1.4 μm/min or more. The copper surface is level and uniform after microetching with the microetchant, completely satisfying the production demand for black oxide pretreatment.