摘要
A Micro Electrical Discharge Machining (MEDM) equipment was developed in this paper,on which the CNC interpolation for 3-axis linkage movement could be realized easily. By this micro-EDM equipment,the fabrication process of microelectrode,micro hole,silicon wafer and complex microstructure was discussed. The process rules of machining efficiency and the relative electrode wear rate as well as the machining mechanism and performance of silicon micro-EDM were also researched. Machining experiments showed that the microelectrode diameter as small as 6 μm and the micro hole with minimum size of 10 μm could be obtained steadily,and the maximum aspect ratios of microelectrode and micro hole were over 25 and 10 respectively. And silicon micro-EDM experiments showed that the micro beam with the aspect ratios over 15 could be obtained easily. And a micro beam with minimum size of 23 μm width on a silicon wafer with 420 μm thickness was achieved. At last,the microstructure machining technology for micro-EDM was also discussed. And a micro-facial sculpture with free space curved surface and size of 1 mm×0.3 mm×0.18 mm was also machined successfully.
A Micro Electrical Discharge Machining （MEDM） equipment was developed in this paper, on which the CNC interpolation for 3-axis linkage movement could be realized easily. By this micro-EDM equipment, the fabrication process of microelectrode, micro hole, silicon wafer and complex microstructure was discussed. The process rules of machining efficiency and the relative electrode wear rate as well as the machining mechanism and performance of silicon micro-EDM were also researched. Machining experiments showed that the microelectrode diameter as small as 6 μm and the micro hole with minimum size of 10 μm could be obtained steadily, and the maximum aspect ratios of microelectrode and micro hole were over 25 and 10 respectively. And silicon micro-EDM experiments showed that the micro beam with the aspect ratios over 15 could be obtained easily. And a micro beam with minimum size of 23 μm width on a silicon wafer with 420 μm thickness was achieved. At last, the microstructure machining technology for micro-EDM was also discussed. And a micro-facial sculpture with free space curved surface and size of 1 mm ×0. 3 mm ×0. 18 mm was also machined successfully.
关键词
微电子流量加工机床
硅加工
微电极
3D结构
micro electro discharge machining
silicon machining
microelectrode
irregular hole
micro 3D structure
