摘要
影响密封继电器使用的可靠性在于其气密性,而玻璃金属封接工艺是气密性的核心工艺。文章进行了一系列硅硼硬玻璃与4J29合金的封接试验,对各个关键封接工艺阶段的样品进行金相分析,得出一些获得气密封接的条件。在本试验条件下,4J29合金零件在1 020°C真空条件下,保温10min～30min,再经过在650°C可控气氛中保温2.5min～5min后,与玻璃坯封接得到的底座,泄漏率95%以上能达到≤1×10-4Pa.cm3.s-1。此外,采用金相技术分析了玻璃合金封接界面的结合情况,并提出了提高玻璃金属封接气密性的途径。
The glass to metal sealing technics is the key factor of the hermeticity of sealed relay, which mostly affects the using relability of sealed relay. After making a series of sealing experiments by 4J29 alloy and borsilicate, we made some metallographic analyses of key processes in sealing technics, and then attained some hermetically sealing conditions. Under this series of experiments, the bases＇ leak rate （LR） was by 95% less than or equal to 1×10^-4pa·cm^3.s^-1 , which sealed by glass tans and 4J29 alloy parts kept in vaccum condition for 10 min - 30 min at 1020℃ and in controllable atmosphere for 2,5min-5min at 650℃. Furthermore, we analysized the bonding state on the surface of glass and alloy by the technology of metallographic analysis, and put forward how to improve the glass-metal sealing hermeticity,
出处
《电子与封装》
2008年第1期5-8,32,共5页
Electronics & Packaging
关键词
封接工艺
金相分析
4J29合金
气密性
sealing technics
metallographic analysis
4J29 alloy
hermeticity
