摘要
文章重点讨论了影响金属器件封装的各种因素。同时对如封焊电流、压力、基座、盖板材料及封焊电极等影响气密封装结果的各种因素做了详细的分析。这些因素为保证器件的气密金属封装提供了可靠的工艺参考。
The article introduces all kinds of factors that affect seam quality for metal packages such as weld current, pressure, electrode, material of package and lid and so on.Analyzed in detail the weld result that all the factors result in. Provide very reliable weld process reference for metal package weld.
出处
《电子与封装》
2008年第1期9-11,共3页
Electronics & Packaging
关键词
封装
平行封焊
高频电源
脉冲
封焊电极
weld
seam weld
high frequency power supply
pulse
weld electrode
