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SiC泡沫陶瓷/SiCp/Al混杂复合材料的导热性能 被引量:4

Thermal Properties of Aluminum Matrix Composites Hybrid Reinforced by SiC Foam and SiC Particles
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摘要 运用挤压铸造法制备了SiC泡沫陶瓷/SiC颗粒/Al混杂复合材料,研究了温度和SiC泡沫陶瓷体积分数对复合材料热膨胀的影响。结果表明:随着温度的升高,复合材料的热容逐渐增大,热扩散系数、导热系数逐渐减小。随着增强体SiC体积分数的增大,复合材料的热容线性下降,热扩散系数和导热系数均非线性减小。由于混杂复合材料具有独特的复式双连续结构,复合材料的导热系数大于130W/(m.℃)。 New model SiC preform made up of SiC foam and SiC particle, SiC foam / particle / Al hybrid composites (V sic=53%, 56%, 59. 9%) for electronic packaging substrate were fabricated by squeeze casting technology. The thermal conductivity of SiC foam/SiCp/Al hybrid composites on the room temperature was higher than 130 W/(m ·℃)because of the special double interpenetrating structure of composites. With increase of the temperature, the specific heat capacity of composites was increased, the thermal diffusivity and the thermal conductivity was decreased. But with the con- tent of SiC reinforcement in the composites, the specific heat capacity was linearly decreased, the thermal diffusivity and the thermal conductivity of composites was fell nonlinearly because of the effect of the thermal barrier at the interface of composites.
出处 《材料工程》 EI CAS CSCD 北大核心 2008年第1期6-10,共5页 Journal of Materials Engineering
基金 华东交通大学博士启动基金资助项目(01306016) 华东交通大学校立科研基金资助项目(07JD06)
关键词 混杂复合材料 导热系数 复式双连续 hybrid composite thermal conductivity double interpenetrating
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  • 1HUNT M. Electronic packaging [J]. Materials in Electronics, 1991, 2: 25-28.
  • 2SHEN Y L, NEEDLEMAN A, SURESH S. Coefficients of thermal expansion of metal-matrix composites for electronic packaging [J]. Metallurgical and Materials Transactions, 1994, 25A: 839-850.
  • 3KUMAR A H, TUMMALA R R. The present and future of muhilayer ceramic muhichip modules in electronic packaging [J]. Journal of Minerals, Metals, Materials, 1992, 44(7): 10-14.
  • 4ZWEBEN C. Metal-matrix composites for electronic packaging. metal-matrix composites for electronic packaging [J]. Journa of Minerals, Metals, Materials, 1992, 44(7): 15-23.
  • 5ZWEBEN C. Advances in composite materials for thermal management in electronic packaging [J]. Journal of Minerals, Metals, Materials, 1998, 50(6): 47-51.
  • 6PREMKUMAR M K, HUNT W H, SAWTELL R R. Aluminum composite materials for multichip modules[J]. Journal of Minerals, Metals, Materials, 1992, 44(7): 24-28.
  • 7ZHANG Q, WU G H, CHEN G Q, et al. The thermal expansion and mechanical properties of high reinforcement content SiCp/Al composites fabricated by squeeze casting technology [J]. Composites: Part A, 2003, 34: 1023-1027.
  • 8CLARKE D R. Interpenetrating phase composites [J]. Journal American Ceramic Society, 1992, 75(4): 739-759.
  • 9ZHAO L Z, ZHAO M J, ZHANG J S. Thermal expansion of a novel hybrid SiC foam /SiCp/Al composite [J]. Journal of Composites Sciences and Technology, in press.
  • 10LEE H S, HONG S H. Pressure infiltration casting process and thermophysical properties of high volume fraction SiCp/Al metal matrix composites [J]. Materials Science and Technology, 2003, 19(8) :1057-1064.

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