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酮酐型热塑性聚酰亚胺的合成与应用研究 被引量:1

Synthesis and Application of Thermoplastic Polyimide Based on BTDA
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摘要 以3,3’,4,4’-二苯甲酮四酸二酐(BTDA)和4,4’-二氨基二苯醚(ODA)为原料,采用化学环化法合成了酮酐型热塑性聚酰亚胺(TPI)。通过DSC测得TPI的玻璃化转变温度为275℃。TGA结果显示TPI的5%质量损失温度为560℃,具有很好的热稳定性;将TPI用于LP-15的增韧发现,在所研究的TPI用量范围内,TPI与LP-15具有很好的相容性,两者间形成了均匀的半互穿网络结构。当TPI的用量为20%(质量分数)时,树脂的Tg比纯LP-15的高13.5℃,简支梁冲击强度提高256%,即同时改善了树脂的韧性和耐热性,取得了传统增韧方法难以实现的效果。 A kind of thermoplastic polyimide (TPI) was synthesized with 3,3', 4,4'-benzophenonetetracarboxylic dianhydride (BTDA) and 4, 4 '-oxydianiline (ODA) as monomers, the imidization process was a chemical one . The glass transition temperature of TPI was 275℃. TGA temperature at 5% mass loss was 560℃,this indicated that the TPI had good thermooxidative stability. Within the interested content range, TPI had good compatibility with LP-15, a semi-interpenetrating network (IPN) was formed between them. When the TPI content was 20% (mass fraction) ,the Tg value and impact strength were 13. 5℃ and 256% higher than those of LP-15 respectively,i, e. The modified resin exhibited simultaneous improvement in both toughness and Tg, which were very difficult to achieve by conventional toughing methods.
出处 《材料工程》 EI CAS CSCD 北大核心 2008年第1期45-48,53,共5页 Journal of Materials Engineering
基金 先进复合材料国防科技重点实验室基金资助项目(51460010105BQ0101)
关键词 热塑性聚酰亚胺 LP-15树脂 增韧 半互穿网络 thermoplastic polyimide LP-15 resin toughing semi-IPN
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参考文献10

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