摘要
W-Cu和Mo-Cu复合材料由于具有优异的导热性、导电性和高温强度以及低的热膨胀系数,广泛用于电接触材料、电子封装材料和热沉材料。金属注射成形大规模制造小型、形状复杂的零部件具有独特的优势,已成为制造W—Cu和Mo-Cu复合材料零部件极具前景的方法。简述了W—Cu、Mo-Cu注射成形工艺的研究进展,并指出了其今后的发展方向。
W-Cu and Mo-Cu composites are used widely as electrical contacts, electronic packaging and heat sinks material due to excellent electrical and thermal conductivity, high temperature strength and low thermal-expansion coefficient. The metal injection molding （MIM） technique which has especial advantages of mass production of small and intricately shaped parts, is becoming one important production route of W-Cu and Mo-Cu composites. The development of W-Cu and Mo-Cu composites by MIM is summarized in this paper, and their development trend is also surveyed.
出处
《材料导报》
EI
CAS
CSCD
北大核心
2007年第F11期207-209,213,共4页
Materials Reports
基金
中南大学大学生创新创业教育项目(LA06027)
