摘要
为了深入了解并控制成形过程中的温度分布,给出了激光金属沉积成形温度测量和采集系统的硬件组成以及标准串口通信软件设计流程图,通过在基材中预埋热电偶的方法,基于VC++,利用RS-232/RS-485和Win32 API函数实现了对激光金属沉积成形过程的温度采集。结果表明,通过该系统可以得到成形过程中基板内特定点的温度变化曲线,反映了成形过程成形零件的温度分布规律,从而为数值模拟提供边界条件和实验验证,具有一定的实际运用价值。
In order to deeply understand and control the temperature distribution, the Laser Metal Deposition Shaping （LMDS） processing, the composition of hardware of collecting system, and the flow chart of communication software of standard series outlet have been given. Through pre-burying couple in basic materials,and based on VC＋＋ , the serial collection of temperature is realized by using RS-232/RS-485 and Win32 API.The results show that the temperature variation curves of certain point in substrate can be collected during shaping processing through this system, reflecting the temperature distribution rule of shaping parts during the shaping process, and they can be used as boundary conditions and experimental verification, which has a certain practical application value.
出处
《电子工程师》
2008年第1期26-29,共4页
Electronic Engineer
