碳化硅颗粒增强铝基复合材料的热性能研究

Research on Thermal Properties of SiCp/Al Composite

碳化硅颗粒增强铝基复合材料由于具有优异的机械性能和物理性能得到越来越广泛的应用,特别是热物理性能能够满足电子封装领域越来越高的要求,适应电子器件集成化程度不断提高的发展趋势。本文介绍和分析影响其导热性能、热膨胀系数及热稳定性的主要因素。

Silicon-carbide-particle-reinforced aluminum composite has been widely used because of its excellent mechanical properties and physical properties, in particular, thermal physical properties can not only meet the increasingly high requirements in electronic packaging, but adapt to the development trends which the electronic device integration degree enhances unceasingly. Silicon-carbide-particle-reinforced aluminum composite has a good heat dissipation performance, adjustable coefficient of thermal expansion and good thermal stability. In this paper, the factors and patterns affecting its thermal properties are introduced and analyzed.