摘要
通过实验确定了各种工艺参数对包括焊膏体积在内的焊膏印刷质量的影响形式,阐述了其具体原理,并对不同焊膏体积下的0201进行组装实验,分析了焊膏量对焊点质量的影响。
In this thesis, the main solder paste printing parameters are tested to get the mode that changes of parameter influence the printing quality, which include the volume of solder paste on pad. The theory of this influence is analysised. The influence of solder paste volume on solder joints＇ quality is reaserched and analysied by test.
出处
《电子工业专用设备》
2008年第1期24-30,33,共8页
Equipment for Electronic Products Manufacturing
关键词
工艺参数
焊膏体积
焊点质量
Process Parameter
Solder Paste Volume
Solder Joint Quality
