自主知识产权产品LIP封装

Independent Intellectual Property Product LIP Package of Huatian Technology

为解决QFN成本较高的问题和进一步提高产品可靠性,华天科技突破了传统思想的束缚,在产品结构的设计上进行了创新。引脚在封装本体内式封装(LIP:Lead In Package)是一种新型的封装形式,它是针对目前QFN(Quad Flat No-lead)在封装高成本问题而重新选择的设计方案。

To resolve the issue of high costs exists in QFN packaging and further improve the product reliability, we made a breakthrough in the shackles of traditional thinking, and innovated in the design of product structure. Leads within the package （LIP： Lead In Package） is a new form of packaging. It is the new design resolution to deal with the high packaging cost problem existed in current QFN （Quad Flat No-lead） packaging.