硅片高温翘曲与常温机械强度

Warpage at High Temperature and Mechanical Strength of Silicon Wafers

不同抗弯强度硅片高温弯曲度变化的实验结果表明，众多因素对抗弯强度和高温弯曲度的影响规律是一致的．高温翘曲度或弯曲度与抗弯强度有内在联系．抗弯强度不仅表示硅片在常温下的抗破碎能力，而且也反应了高温抗翘曲和弯曲能力．

The relationship of the warpageat at high temperature and fie-cure strength of silicon wafers is studied by measurement of fie-cure strength and change of bowingness of silicon wafers after heat treatment. The laws of effect of various factors on warpage and fie-cure strength of silicon wafers are all the same. The fie-cure strength of silicon wafer can reflect its ability of anti-warping or bowing at high temperature to a certain degree.