摘要
介绍了铜箔的用途和分类,以及电解铜箔和压延铜箔的生产方法,简述了印制电路板用铜箔的表面处理工艺流程,对比了国内外印制电路用铜箔的制备方法和表面处理技术。国内已能生产出厚度为9μm的电解铜箔,但压延铜箔的生产技术有待于研究。
The application and classification of copper foils are introduced and the manufacturing methods of electrodeposited and rolled-wrought copper foils are reviewed. The process flow of surface treatment of copper foil for PCB is also briefly outlined. The home and foreign manufacturing methods and surface treatment technologies of these copper foils are compared. At home, the electrodeposited copper foils, with the thickness of 9 μm, have been successfully prepared, while the technologies for the rolled- wrought ones are to be developed.
出处
《电镀与精饰》
CAS
2008年第2期17-20,23,共5页
Plating & Finishing
关键词
铜箔
印制电路
表面处理
工艺流程
copper foil
printed circuit
surface treatment
process flow
