摘要
We achieve a successful novel lift-off of patterning Pt/Ti electrodes on SiO2/Si substrates by employing ZnO sacrificial layer deposition and patterning, successive uniform Pt/Ti deposition and final lift-off. Then we deposit PZT thin films on the electrodes. Compared with the conventional lift-off processes for the electrodes, this novel process does not need post-annealing, which must be performed after conventional lift-off process. It is demonstrated that the electrodes patterned by the novel lift-off process have stronger adhesion. The electrodes and the PZT films on the electrodes are more compact and smoother than those by the conventional lift-off process.
We achieve a successful novel lift-off of patterning Pt/Ti electrodes on SiO2/Si substrates by employing ZnO sacrificial layer deposition and patterning, successive uniform Pt/Ti deposition and final lift-off. Then we deposit PZT thin films on the electrodes. Compared with the conventional lift-off processes for the electrodes, this novel process does not need post-annealing, which must be performed after conventional lift-off process. It is demonstrated that the electrodes patterned by the novel lift-off process have stronger adhesion. The electrodes and the PZT films on the electrodes are more compact and smoother than those by the conventional lift-off process.
基金
Supported by the National Natural Science Foundation of China under Grant Nos 90207003 and 90607003.
