摘要
光刻工艺及其成品率对掩模洁净度要求极高。通过一系列研究分析,找到了传统掩模清洗工艺的一些缺点和局限性,借鉴和参考了传统掩模清洗工艺,克服了其局限性。基于精密掩模对加工质量的高要求,安装了保护膜并改进了精密掩模清洗工艺,通过试验形成了最终工艺。新清洗工艺的开发满足了0.5μm掩模加工洁净度要求。
Lithography process and its yield require high cleanliness on the mask. Through a series of researches and analysis, the weaknesses and limitations of the traditional mask cleaning technology were found. The limitations were overcome by referring to the traditional mask cleaning technology. Based on the high requirements of precision mask processing on quality, the pellicle mount was done and the precision cleaning process was improved, final process was completed with experiments. The development of the new process meets the cleanliness requirement of the 0.5μm mask processing.
出处
《半导体技术》
CAS
CSCD
北大核心
2008年第2期151-154,共4页
Semiconductor Technology
基金
国家部委基金项目
关键词
掩模
清洗工艺
保护膜
mask
cleaning process
pellicle