摘要
探讨新发明的柔性磨体振动抛光机理，介绍机床结构特点与应用范围，并从加工表面质量与生产率等方面与超声波抛光、粘弹性磨料流加工等方法作分析比较。
The polishing mechanism of a new developed vibrational polishing process with flexible grinder is explored, the structure characteristics of the machine tool and the application fields are introduced in the paper. The machinedsurface quality and productivity of the new process are compared with that of ultrasonic polishing and viscoelastic grain flow machining processes.
出处
《中国机械工程》
EI
CAS
CSCD
北大核心
1997年第3期107-109,共3页
China Mechanical Engineering
基金
江苏省应用基础研究基金
关键词
抛光
柔性磨体
机理
振动
抛光
polishing flexible grinder vibration mechani
