摘要
随着主频的提高、布线密度的增加以及众多大规模集成电路的应用,使得产品对PCB设计的要求越来越高。在应用EDA软件的基础上,对高速PCB设计中越来越突出的电磁兼容问题及其解决方法进行了分析与探讨。
The requirements for PCB design are increased with higher frequency, denser and more VLSIs on a board. With EDA software, the EMC problems of high-speed PCB design and their solutions are discussed in this paper.
出处
《电子产品可靠性与环境试验》
2008年第1期8-12,共5页
Electronic Product Reliability and Environmental Testing
