无线通信系统的封装技术
无线通信系统的封装技术
摘要
本文讨论了两种适于低成本、小形状因子的无线通信系统的封装工艺。首先描述了一种嵌入式无源工艺,其目标在于减小RF前端模块的形状因子和基带电源供应,方法是使用高性能的电感、电容、电阻,以及在封装衬底上嵌入的衍生电路。其次,描述了一种新的堆叠封装结构,它适用于通信和无线产品。此封装方案在单一封装内集成高速处理器和存储器,提供优异的信号完整性和高布线密度。
出处
《中国集成电路》
2008年第2期55-63,69,共10页
China lntegrated Circuit
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