摘要
随着高密度电子组装技术的不断发展,电子设备的体积越来越小,而功率却越来越大。热功耗的显著增加将对半导体芯片的正常工作产生很大的影响。对装有功率放大器芯片的射频模块热性能进行了分析,提出了有效热控制的解决方法,为射频功率模块的可靠、稳定工作提供了保障。
Along with the development of high-density electric assembling techniques, the volume of electric equipment tends to be smaller and smaller,and power becomes higher and higher. The thermal power dissipation increasing greatly will have a great influence on the normal operation of semiconductor chips. This paper analyzes the thermal performance of RF module with power amplifier chips,suggests some solutions for effective thermal control, which ensures the reliable and stable operation of RF power modules.
出处
《舰船电子对抗》
2007年第6期112-114,共3页
Shipboard Electronic Countermeasure
关键词
射频功率模块
结温
热阻
热控制
RF power module
junction temperature
thermal resistance
thermal control
