混成焦平面器件倒装互连设备对准精度分析

Alignment Accurcy Analysis of The Flip Chip Bonder for Hybrid FPA

讨论了混成焦平面倒装互连常用的重叠影象对准方式的对准精度。认为重叠影象对准方式的对准精度受对准系统物镜的对准精度、光学转换精度等的限制。

Accuracy of Superimposed images method for the alignment of hybrid FPA technologies isdiscussed. The align ment accuracy is Supposed to be limited by accuracy of an objective alignmentand conversion.