纳米Ag-Cu-In-Sn合金粉末的制备及其热分析

Preparation and Thermal Property Analysis of Ag-Cu-In-Sn Nano-Powder

利用直流电弧等离子体法成功制备了分散性较好的纳米链状Ag-Cu-In-Sn合金粉末。用X射线衍射(XRD)、透射电镜(TEM)和差示扫描量热分析(DSC)等手段对粉末的结构、粒度和热性能进行了表征。研究结果表明:通过优化工艺可制备粒度分布均匀,产率较高,平均粒度在45.03nm的Ag-Cu-In-Sn合金粉末。该粉末具有独特的热性能,与微米合金粉末的熔点相比,其熔点下降了近160℃。

Chain shaped, well dispersal and nano-scale Ag-Cu-In-Sn powders were successfully prepared by DC arc plasma method. The structure, particle size and thermal properties were studied by XRD, TEM and TG-DSC. Results show that Ag-Cu-In-Sn powder with 45.03 nm particle size and homogeneous distribution can be produced by the optimized process. The powder has its unique thermal performance, and its melting point decreases by about 160 ℃ compared with that of micro-scale powder.