摘要
MCM-D是近年来发展起来的高密度多芯片组装技术,其制做工艺同IC工艺相兼容,因此在IC生产厂家发展得很快。本文主要介绍用IC加工工艺和设备制备MCM-D技术以及MCM—D的芯片安装技术。
The process of MCM -D is a technology of high density multichip modules and developed in the last few years. The process correspand to IC process. So it is developing rapidly in the IC plant. This paper introduces the process of MCM-D technology by the process and equipment of IC and the chip assembly of MCM-D.
出处
《微处理机》
1997年第3期25-27,共3页
Microprocessors