摘要
研究了在Sn-58Bi合金中添加少量Al后对合金性能、恒温时效焊点组织稳定性及接头界面处金属间化合物层生长的影响。研究结果表明:在80℃时Sn-58Bi合金具有稳定的组织结构,但超过100℃Bi相会异常粗化,导致合金性能变差。在100℃恒温时效试验中,Al能有效抑制Bi相的粗化,接头界面处IMC层的生长呈减缓趋势。随着Al含量的增加,Sn-58Bi-Al系合金的拉伸强度增大,铺展性有所降低。
The effects of Al addition to Sn -58Bi alloy on the properties and the structural stability of the solder, and IMC growth at the interface under isothermal aging condition have been studied. The structural of Sn -58Bi solder is stable at 80 ℃. However, Bi phase of Sn -58 Bi solder is coarsened above 100 ℃ which results in poor properties. The addition of Al reduces the coarsening rate of Bi ageing at 100 ℃. Meanwhile, the trend of IMC growth is slowed down on the solder joint. With the increase of Al, the tensile strength of the alloy raises; at the meantime ,spreading property of the alloy decreases.
出处
《电子工艺技术》
2008年第1期1-4,共4页
Electronics Process Technology
基金
国家自然科学基金资助项目(项目编号:50371010)
