期刊文献+

无铅焊料用免清洗助焊剂的研究 被引量:15

Study of a New No-clean Flux for Lead-free Solder
下载PDF
导出
摘要 用润湿力试验和铺展试验来确定活性组分和溶剂,研制了一种以醇作为溶剂的免清洗助焊剂。结果表明:该助焊剂选用复合有机酸和有机胺作为主要活性成分,有机酸的配比为1∶2时有很好的助焊效果,选择醇类作为溶剂对有机酸的溶解性好;该免清洗助焊剂助焊性能良好,腐蚀性小,焊后可以免于清洗。 The properties of wetting power and spreadability with active agent and dissolvent were tested according to the industry standard, a new no -learn flux was researched which chooses alcohols for the dissolvent. The result shows that when the active agent were chosen from the organic acid and organic amine for compounding;and when the proportion by weight of organic acid B and organic acid C is 1:2 has a good welding performance, the dissolvent is alcohols has a good dissolvability to the organic acid, the flux is good welding performance,low -corrosive, the residue after welding need not be cleaned.
机构地区 北京工业大学
出处 《电子工艺技术》 2008年第1期12-15,共4页 Electronics Process Technology
基金 十一五"国家科技支撑重点项目"含有害材料元素材料替代技术(项目编号:2006BAE03B02)
关键词 免清洗 活性组分 溶剂 铺展面积 No - clean Activator agent Solvent Spreadability
  • 相关文献

参考文献6

二级参考文献14

  • 1吴贵芬,韩淑珍,张扩.免清洗助焊剂[J].电子工艺技术,1995,16(4):9-11. 被引量:5
  • 2张银雪.电子工业用高效助焊剂的研究[J].黎明化工,1996(6):30-33. 被引量:5
  • 3GB/T15829.1-1995..中华人民共和国国家标准.软钎焊用钎剂树脂类钎剂[S]..,,....
  • 4Rocak D,Bukatb K.Comparison of new no-clean fluxes on PCBs and thick film hybrid circuits[ J].Microelectronics journal 1999,30:888-889.
  • 5Chien-Tai Lin,Kwang-Lung Lin.Contact angle of 63Sn-37Pb and Pb-free solder on Cu plating [ J ].Applied surface science,2003,214:243-258.
  • 6[3]姜蛲霞.化学镀理论与实践[M].北京:国防工业出版社,2000,426-428
  • 7[4]Yang E, Doss s k, Peterson P. Electroless Ni-Cu-P alloy in an atmospheric gas chamber[J]. Plating and Surf, 1988, 75(12)
  • 8薛树满,肖坤,周瑞山,等.应用和考核免清洗助焊剂的几个关键问题[J].印刷电路、表面贴装工艺与设备,1998,(3):51.
  • 9肖尚明.焊膏配用焊剂的研制[J].电子工艺技术,1998,19(2):58-59. 被引量:17
  • 10夏建亭.免洗低残留助焊剂的选择与使用[J].电子工艺技术,1999,20(1):21-23. 被引量:12

共引文献59

同被引文献131

引证文献15

二级引证文献56

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部