摘要
总结SMT焊锡膏印刷过程中常见缺陷,对印刷机印刷机理以及影响焊锡膏印刷质量的因素进行深入剖析,对常见的印刷缺陷进行了原因分析,提出了解决方法。在焊锡膏印刷过程的各工序中,提出了工艺控制要求,最终降低了焊锡膏印刷过程中的缺陷率。
Sum up the common defects in SMT print process. Analyze the mechanism of printer and factors which affect the soldering quality, and the reasons of defects, put forward the process control requirements for each procedure, As a result,the defect rate is reduced.
出处
《电子工艺技术》
2008年第1期19-23,共5页
Electronics Process Technology
