摘要
无铅化电子组装中,由于原材料的变化带来一系列工艺的变化,随之产生许多新的焊接缺陷。针对表面裂纹、表面发暗及二次回流等缺陷进行了机理分析,并给出了相应的解决措施。
Changes of material bring a series of process problems in lead - free electronic assembly with occurrence of new solder defects. Analyze causes and give solution of solder defects for surface crack, coarse surface finish of solder joint and the 2nd reflow issue.
出处
《电子工艺技术》
2008年第1期53-56,共4页
Electronics Process Technology
关键词
无铅
焊点
表面裂纹
表面发暗
二次回流
Lead - free
Solder joint
Surface crack
Coarse surface finish
The 2nd reflow
