摘要
研究了不同电流密度下所得低温镀铁层的沉积速率、显微硬度和腐蚀速率。结果表明,当电流密度为14A/dm2时镀层可获得最佳的综合性能。电流密度过低时,镀层沉积速率慢,硬度低;电流密度过高时,镀层表面出现针孔,厚度不均。
The deposition rate, microhardness and corrosion rate of Fe coating prepared by low-temperature plating at different current densities were studied. The results showed that the Fe deposit obtained at 14 A/dm^2 has optimal comprehensive performance, The Fe deposit prepared at too low current density has low deposition rate and microhardness, and that prepared at too high current density has pinholes on the surface with non-uniform thickness.
出处
《电镀与涂饰》
CAS
CSCD
2008年第2期15-16,共2页
Electroplating & Finishing
关键词
镀铁工艺
低温
电流密度
沉积速率
显微硬度
耐蚀性
iron plating process
low temperature
current density
deposition rate
microhardness
corrosion resistance