基于分层八邻域方向预测算子的IC芯片图像拼接技术

Image-Splicing Technology for IC Chip Inspection Based on Direction-Predicting Operator of Grading 8 Neighborhoods

为了对IC芯片进行精密光学检测,需要完整而准确地获取芯片形貌的图像.文中针对IC芯片表面形貌图像的获取要求,提出了一种基于分层八邻域方向预测算子的模板匹配方法,并运用于高精度要求的IC芯片图像处理工作中.通过对获得的芯片显微图像的重叠部分进行匹配点的快速准确搜索,进而实现了芯片精密显微图像的高速拼接处理.编程实验证明,采用该方法可获得IC芯片表面的清晰图像,使芯片的形貌和缺陷等细节能够得到很好的展现.

In the accurate optical inspection of the IC chip, it is necessary to obtain complete and accurate images describing the surface features of the chip. For this purpose, a template matching method based on the directionpredicting operator of grading 8 neighborhoods is proposed andis then applied to the high-accuracy image splicing of the IC chip. By quickly and accurately searching the matching pixel in the overlapping part of the microscopic image, high-speed splicing of IC chip images is implemented. Experimental results indicate that the proposed method helps to obtain clear microscopic surface images of the IC chip as well as display effectively its topography and micro-flaws.