摘要
在铝合金表面电镀铜,可以得到特殊性能的铜包铝导体,兼有铜的优良导电性和铝的密度小的优点,铜包铝导体在很多领域都有应用。采用焦磷酸盐体系在铝合金表面电镀铜,对该工艺进行总结并优化工艺参数,得到了结合牢固的铜镀层,并对不同电镀条件下的镀层微观组织进行观察和分析。
Hating copper on aluminium alloy can obtain a special kind of conductor, which with aluminium in it and bundled with copper. It has many advantages, especially in low density and electrical conductivity. This technics can be widely applied. In this experiment, copper was electroplated on aluminium alloy in pyrophosphate. This paper generalized the technics and optimized the parameter, good deposition adhesion was gotten. The surface morphologies of electroplated sample were observed and analyzed.
出处
《轻合金加工技术》
CAS
北大核心
2008年第2期30-33,共4页
Light Alloy Fabrication Technology
关键词
铝合金
电镀铜
超声波搅拌
aluminium alloy
copper electroplating
ultrasonic agitation
