摘要
研究了聚酰亚胺(PI)先驱体和发泡温度等工艺参数对PI泡沫结构的影响,采用DSC,TGA和光学显微镜对PI泡沫结构进行观察及表征。研究发现:先驱体的发泡温度应在150℃左右,随着发泡温度的升高,泡沫的密度降低;泡沫具有突出的开孔特性,开孔率高达93%以上;泡沫的密度主要取决于泡沫孔数和泡孔壁厚。
The effect of the PI precursor powder and foaming temperature on polyimide foam structure was investigated. The polyimide foam structure was observed by DSC and TGA, and was characterized with optical microscope. The compendious model was applied to simulate the influencing factors. The results indicated that the foaming temperature of PI precursor was about 150℃. A decreased of foam density with the foaming temperature increased. Polyimide foams have the open cells, the open cell content was more than 93%. The foam density was determined by the cell numbers and thickness.
出处
《化工新型材料》
CAS
CSCD
北大核心
2008年第2期47-49,共3页
New Chemical Materials
关键词
聚酰亚胺泡沫
泡沫结构
发泡温度
泡沫密度
polyimide foam, foam structure, foaming temperature, foam density