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无铅钎料焊点界面与剪切行为的研究 被引量:1

Study on interface and shear behavior in lead-free solder joint
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摘要 研究了三种不同合金钎料回流时间和老化时间对焊点界面行为和剪切性能的影响。结果表明:回流时间和老化对金属间化合物的生长和剪切力有相似的影响;焊后界面处和焊料中均有明显的金属间化合物;随着回流时间和老化时间的延长,金属间化合物生长明显。层厚不断增大;界面形貌从长针状转变成扇贝状,并且齿高减小;合金成分对剪切力影响不明显。在中速应变率下,剪切力减小。Sn-3.5Ag显现出较好的剪切性能,剪切力为77-82N。 The influences of reflow time and aging time in three lead-free solders on solder joint interface and shear strength were investigated. The results show that the effect of reflow time and aging time on IMC and shear force is quite similar. IMC remarkably develop with increasing reflow and aging time, shear force decreases. In addition, it is also found that the effect of alloy component on shear force is not significant, and Sn-3.5Ag presents the better shear property than the others, shear force is 77-82 N.
出处 《电子元件与材料》 CAS CSCD 北大核心 2008年第1期74-76,共3页 Electronic Components And Materials
基金 河北省自然科学基金资助项目(E2006000832) 河北省教育厅自然科学基金资助项目(2005206)
关键词 电子技术 无铅钎料 金属间化合物 剪切强度 electron technology lead-free solder IMC shear strength
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参考文献7

  • 1Lee N C. Lead-free soldering-where the world is going [J]. Adv Microelectron, 1999, 26(5): 29- 35.
  • 2Lee N C. Getting ready for lead-free solders [J]. Soldering Surf Mount Technol, 1997, 9(2): 65-68.
  • 3Wu J C L, Lee C B, Chou Y S, et al. Development eY lead free package and its reliability [R]. Hawaii: Proc IPACK'01-ASME, 2001.
  • 4Kim K S, Huha S H, Suganuma K. Effects of intermetallic compounds on properties of Sn-Ag-Cu lead-free soldered joints [J]. J Alloys Compd. 2003, 352: 226-236.
  • 5Lee H T, Chen M H, Jao H M, et al. Influence of interfacial intermetallic compound on fracture behavior of solder joints [J]. Mater Eng A, 2003, 358: 134-141.
  • 6Ding Y P, Qi F J, Xu C Let al. The effect of reflow time on intermetallic compound in lead-free micro-joining Joint [A]. The 7th International Conference on Electronics Packaging Technology [C]. Shanghai China: IEEE, 2006. 454-456.
  • 7Joon Y C. Study on inter-metallic compound (IMC) at interface of Pb-Free solder and nickel UBM for mobile application [A]. Electronic Components and Technology Conference [C]. USA: Reno Nevada, 2007. 1802-1808.

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