塑胶封装器件的全自动声像(声学显微镜)检测

Automated Acoustic Micro Imaging Acoustic Microsoopy Of Plastic Packages

全自动声像系统被用于塑胶和多芯片器件的成像及分析。声像及数据可非破坏识性地识别如芯片表面及芯片银胶层的分层等内部缺陷。不符合标准的器件将从装配线上除去。

Automated acoustic micro imaging was used to image and analyze Plastic Quad Flat Packs and Multi-Chip Modules. The acoustic images and data nondestructively identified internal defects, including die face delaminations and die attach defects. Devices that did not meet the user＇s accept/reject criteria were removed from assembly.