硅微粉填料在覆铜板中应用的研究进展

Progress of Research on Micro Silica Filler for Copper Clad Laminate

近年,在CCL的新品开发、性能改进方面,采用无机填料的技术已成很重要的手段。而在众多无机填料中,硅微粉越来越突出其重要地位。文章主要通过介绍、分析日本近年发表的此方面专利内容,阐述CCL业在硅微粉应用技术方面的新进展。

In recent years, technology of inorganic filler is getting a main method to R＆D and improvement of performance in copper clad laminate （CCL）. Silica filler compared to the other inorganic filler is getting more and more important too. In the paper, the patents about silica filler used in CCL were introduced. At the same, the progress of CCL technology about application of silica filler was reviewed.