摘要
概述了镀锌的铜箔暴露于老化处理氛围中(313K,90%RH,168h)以后,铜箔上镀锌层的取向和HCl浸渍后的剥离损失对附着性的影响。试验结果表明箔镀层(0002)取向的锌基面比其它取向具有较低的HCl浸渍后的剥离损失。
This paper describes the effect on adhesion between the orientation of Zn plating on the Cu foils and peel loss after HCI immersion, after the electro-galvanized Cu foils were exposed to the aging treatment atmosphere （313K, 90% RH, 168h）. The experimental results indicated that the foils plating （0002） oriented Zn based plane had a lower peel loss after HCI immersion than the other orientalion.
出处
《印制电路信息》
2008年第2期36-41,共6页
Printed Circuit Information
关键词
镀锌层
优先取向
铜箔
老化处理
试验
HCI浸渍后的剥离损失
zine plating
preferred orieintation
copper foil
aging treatment
test
peel loss after HCIimmersion
