倒装芯片下填充工艺的新进展(二)

Recent Advances of Flip-Chip Underfill Process(2)

为了增加在有机基板上倒装芯片安装的可靠性,在芯片安装后,通常都要进行下填充。下填充的目的是为了重新分配由于硅芯片和有机衬底间热膨胀系数失配产生的热应力。然而,仅仅依靠填充树脂毛细管流动的传统下填充工艺存在一些缺点。为了克服这些缺点,人们研究出了一些新的材料和开发出了一些新的工艺。

In order to enhance the reliability of a flip chip on organic board package, underfill is usually used to redistribute the thermo mechanical stress created by the coefficient of thermal expansion （ CTE ） mismatch between the silicon chip and organic substrate. However, the conventional underfill relies on the capillary flow of the underfill resin and has many disadvantages. In order to overcome these disadvantages, many variations have invented to improve the flip chip underfill process.