期刊文献+

中温固化单组分无机/有机杂化耐高温结构胶粘剂 被引量:6

Medium temperature curing one component inorganic/organic hybridization heat-resisted constructional adhesive
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摘要 采用酚醛-有机硅-丁腈-石棉体系制备的结构胶粘剂,加入酚醛树脂固化促进剂使胶粘剂能够中温(130℃)固化,室温贮存期达半年以上,达到单组分的目的,并提高了胶粘剂的力学性能和耐热性能。其瞬间耐热可达900℃,常温剥离强度可达1.7 kN/m,用于导弹弹头、发动机喷嘴等碳-碳复合材料的自粘或与金属材料的粘接。 This paper introduces a kind of medium temperature( 130℃ ) curing one component inorganic/organic hybridization heat-resisted constructional adhesive. The adhesive can be stored for 0.5 year at room temperature. Peel strength of the adhesive is 1.7 kN/m. at R. T.. It can be used at 700 - 900 ℃ for instant period and at 250℃ for long period in aerospace and airplane industry, and shows a better synthesis property.
作者 吴大青
出处 《黑龙江科技学院学报》 CAS 2008年第1期77-80,共4页 Journal of Heilongjiang Institute of Science and Technology
关键词 中温固化 单组分 杂化 耐高温 结构胶粘剂 medium temperature curing one component hybridization heat-resisted constructional adhesive
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参考文献7

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二级参考文献11

  • 1高志军,蔡颖,杜杰,温宇鹏.超立方体三次幂的可区别数研究[J].大连海事大学学报,2006,32(2):121-126. 被引量:7
  • 2ALBERTSON M,COLLINS K. Symmetry breaking in graphs[J]. Electron J Combin, 1996(3) : 1-17.
  • 3BOGSTAD B, COWEN L. The distinguishing number of the hypercube[J]. Discrete Mathematics, 2004,283: 29-35.
  • 4CHENG C C T. Three problems in graph labeling[D]. [S. l.] :Johns Hopkins University. 1999:1-165.
  • 5POTANKA K. Groups, graphs and symmetry breaking[ D]. [ S. l. ] : Virginia Polytechnic Institute, 1998:1-63.
  • 6RUSSELL A, SUNDARAM R. A note on the asymptotics and computational complexity of graph distinguishability[J].Electron J Combin, 1998(5) : 1-7.
  • 7ALBERTSON M,COLLINS K,Symmetry breaking in graphs[J].Electron.J.Combin,1996,(3):1-17.
  • 8BOGSTAD B,COWEN L.The distinguishing number of the hypercube[J].Discrete Mathematics,2004,283:29-35.
  • 9CHENG C C T.Three problems in graph labeling[D].Baltimore,Maryland,USA:Department of Mathematical Sciences,Johns Hopkins University,1999.
  • 10POTANKA K.Groups,graphs and symmetry breaking[D].Virginia,USA:Department of Mathematics,Virginia Polytechnic Institute,1998.

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