摘要
介绍了GaN基材料的基本特性、三种主要外延生长技术(MOCVD、MBE、HVPE)、衬底材料的选择及缓冲层技术;分析得出目前存在的GaN体单晶技术不完善、外延成本高、衬底缺陷及接触电阻大等主要问题制约了研究的进一步发展;指出今后的研究重点是完善GaN体单晶材料的生长工艺,以利于深入研究GaN的物理特性及有效地解决衬底问题,研究缓冲层的材料、厚度、组分等以提高GaN薄膜质量。
The basic properties of GaN-based materials, three mainly epitaxy growth technologies (MOCVD, MBE, HVPE) , substrate materials and buffer layers are introduced. The mainly remaining problems are the faulty GaN bulk crystal technology, high epitaxy cost, low yield rate, more defect, large contact resistance and so on, which influence the research progress deeply. The further research focus is to improve GaN bulk crystal growth method for studying GaN physical properties, to solve substrate problems effectively, to study the material, thickness and composition of buffer layers for improving GaN film quality.
出处
《微纳电子技术》
CAS
2008年第3期153-157,共5页
Micronanoelectronic Technology
关键词
氮化镓
金属有机物化学气相淀积
分子束外延
氢化物气相外延
缓冲层
GaN
metal organic chemical vapor deposition (MOCVD)
molecular beam epitaxy (MBE)
hydride vapor phase epitaxy (HVPE)
buffer layers