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化学镀Fe-TM-B(TM=Mo,W,Mo-W)合金镀层的显微硬度

MICROHARDNESS OF THE CHEMICALLY PLATING LAYER OF Fe-TM-B (TM=Mo, W, Mo-W) ALLOYS
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摘要 利用显显微硬度测量和X射线衍射结构分析,研究了化学镀Fe-Mo-W-B非晶态合金镀层的显微硬度随成分、热处理温度及结构的变化关系。结果表明,合金镀层的显微硬度随B含量增加而增加,电子浓度的变化规律与其相反。在相同B含量区域,Fe-MO-W-B镀层的硬度值介于Fe-MO-B与Fe-W-B镀层硬度值之间。热处理过程中,合金镀层的显微硬度在1400℃出现峰值,与晶化过程及晶化析出相的类型及数量有关. The variation of microhardness of chemically plating layer of Fe-Mo-W-B monocrystal alloy with composition, heat treating temperature and structures is investigated withmfcrohardness measurement and X-ray diffraction structure analysis. Results show that, themicrohardness of alloy plating layer is increased with the content of B, but decreased with ionconcentration. In the same range of B content,the hardness of Fe-Mo-W-B plating layer is situated between that of Fe-Mo-B and Fe-W-B. In the heat treating process,the peak value appealsat 400℃, and is related with crystallization process and the type and amount of the educt ofcrystals.
出处 《上海有色金属》 CAS 1997年第3期106-110,共5页 Shanghai Nonferrous Metals
关键词 化学镀 显微硬度 非晶态合金 镀层 Chemically plating, Fi-Mo-W-B alloy, Microhardness, Heat treatment, Educt of crystals
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