炭黑化学镀铜及性能研究

STUDY ON ELECTROLESS COPPER PLATING PROCESS OF THE CARBON BLACK AND THE PERFORMANCE OF THE PRODUCT

以甲醛为还原剂,硫酸铜为主盐,采用还原法,在不同种炭黑表面化学镀铜。检测不同种镀铜炭黑的物理性能,包括电阻率、摩擦系数等;利用金相显微镜对各种镀铜炭黑进行金相分析,利用晶粒度评级软件分析镀铜炭黑的平均粒径。结果表明:控制合适的工艺条件,镀铜层能够比较完整地包覆在炭黑粒子及炭黑聚集体的表面,炭黑镀铜率可以高达70%;炭黑粒径越小,单位质量炭黑的比表面积越大,表面活化中心也越多,铜在发黑表面的包覆效果越好;石墨化后炭黑的镀铜效果较石墨化前有所提高。

In the paper ,carbon black was coated successfully by reduction method in which formaldehyde is used as a reducing agent and bluestone as a main salt. Using the same prescription,different kinds of carbon black were coated by electroless copper-plating method. Then,some physical properties of the copper-coated carbon black were determined ,including electric resistivity and friction coefficient. Furthermore, these kinds of copper-coated carbon black were analyzed by metaloscope,and the software of granularity analysis was used to analyze the average grain size of the copper-coated carbon black. Results indicate that as long as we appropriately controi the technological conditions,the surface of carbon black particle and aggregates can be coated with copper perfectly ,and the percentage of copper is up to 70%. Furthermore, it is found that the smaller particle size of carbon black is, the better copper-plating coated is. The reason is that the smaller particle size of carbon black is the better copper-plating coated is the reason is that the smaller particle size of carbon black is the larger its specific surface area and its activation center is more. Results also show that graphitized carbon black get the better plating coated than original carbon black.